Analytical Methods for Developing an Effective Sawing System
Diamond sawing is now widely acknowledged as a viable method for die separation of microelectronic substrates. Technologies like diamond grinding and dicing make it possible to cut completely through a wide range of substrate materials without having to perform any additional steps as scribe and break did in the past.
Because of this, one might conclude that the debate ought to be closed because there are currently no issues with die separation. It’s tempting to believe that any available dicing machine and blade combination could be used to complete any cutting task. However, the reality is that the efficient sawing system that is required needs a great deal of careful planning and control over these variables. This text cannot address all of the variables and the effects they have.
When determining the best system component for a project, it is essential to evaluate its rigidity, power rating, and cooling capabilities. Also, it’s important to know that the sawing efficiency of the dicing process is dependent on the compatibility of all of the parts that make up the interactive system. Also, if one part is wrong, it could make all the other parts that were picked right useless.
When selecting a diamond blade and/or setting the system’s operating parameters, end-users are frequently misled by situations like these. As a result, an attempt is made to treat a symptom rather than the problem’s root cause. A truly cost-effective and competitive wafer sawing system may never be developed using this method. Experience has shown that changing the coolant nozzle, changing the mounting method, or teaching the user relatively simple things like how to care for a diamond dicing blade and flange can often solve major sawing issues. Our uncomplicated solutions have drastically boosted throughput and productivity, often to the tune of a tenfold increase.
Power for Dicing Machines Is Essential To the Success of Dicing Operations
Recently, manufacturers of dicing saws have begun to consider power requirements for sawing extremely brittle and hard materials. Earlier machines had a fixed spindle speed of 30,000 RPM and a relatively low horsepower intended solely for the dicing of silicon materials.
Despite the higher power ratings of their spindle motor drives, newer models still require extra caution when purchased. This is because the cutting requirements of various hard materials necessitate variable spindle speeds, and the majority of machines only provide maximum horsepower at the highest end of the variable range.
When spinning slower, dicing saws set to deliver peak power at 30,000 RPM can experience a dramatic decrease in performance. To avoid stalling or overworking the spindle power train, the user is frequently forced to continue cutting at peripheral speeds higher than recommended. An inadequate cutting production or a complete breakdown in processing the dicing material can be expected as potential outcomes.
It would be erroneous to assert that contemporary dicing machines or their former grinder-style predecessors were poorly designed, as every device was crafted and produced for a precise function. Prior to investing in a machine, it is essential to evaluate which tasks must be completed. When determining the optimal power requirements, the volume of dicing material to be removed, the kind of material, the diamond size, the operating speed, and the throughput are the most important factors.
In most cases, the internal matrix of the diamond blade can be used to compensate and cut down on the amount of power needed to complete a particular task. The most common methods use compositions with a lower density or larger abrasives3. In most cases, a reduction in cut quality, throughput, and wafer dicing blade life comes at the expense of such compensation.
The rigidity of a system impacts the efficiency of sawing operations, making it essential for slicing thin silicon materials with feed rates as fast as one inch per second or cutting through thick ceramic-based components. It is crucial to keep in mind that rigidity includes not only the equipment being used but also the diamond wafer dicing blade, work piece mounting techniques, and operating parameters; Hence, discussing system rigidity with the machine as a component of the system as a whole.
The majority of dicing and slicing saws have a lot of options, but these options don’t necessarily make a machine better at its fundamentals for successful cutting. The machine’s fundamental construction and movement requirements should be the first consideration for a potential user. Choosing must be based solely on the applicable commanding mechanisms if these components are officially capable of executing the assigned task.
To ensure optimal performance and durability, the machine base foundation should be designed and constructed to counter flex under load or vibration transmission for its integral movements. Cast aluminum, which is frequently used in desktop wafer dicing services, must be sufficiently ribbed to provide appropriate stiffness, whereas cast iron, which is typically used in floor model machines, offers good stiffness and dampening properties. To provide optimal stability and improved vibration-dampening effects, certain base castings are being crafted using epoxy cement or in conjunction with ultra-precise applications of cast iron material. A fundamental understanding of the strengths and properties of the various materials that are currently utilized in the design of saw foundations aids in the selection of the appropriate base for specific purposes.
For dicing and diamond grinding, you need a spindle that is mounted rigidly and has very little end play or vibration. The amount of work that needs to be done plays a major role in deciding between an air spindle and a ball-bearing spindle. Heavy cuts and dicing operations with multiple blades typically call for precision ball-bearing spindles. Within their intended applications, both kinds of spindles are capable of producing precise finishes and tolerances. Air-bearing spindles are the preferred choice for desk-top dicing saws due to their superior performance and high speed operation. The user’s care during operation greatly influences the “frictionless” air spindle’s lifespan.
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